6th Semiconductor Fabs Design, Engineering & Construction APAC 2026 in Singapore is a focused forum for the people who plan, design, build and expand fabs and advanced packaging plants across Asia-Pacific. This is not a general semiconductor technology or policy show - it is about facilities, utilities and capex delivery for multi-billion-dollar manufacturing projects from front-end fabs to OSAT and advanced packaging lines.

With APAC capturing the majority of new global fab and packaging investments through 2030, project teams are under pressure to add capacity while wrestling with grid constraints, water and wastewater complexity, cleanroom and vibration challenges for advanced nodes, and tight construction markets that threaten schedules and budgets. Hosted in Singapore, a neutral, infrastructure-strong hub with ongoing expansion of a new 22 nm fab and a national semiconductor innovation facility, the summit is built around real project experience.

Over two concentrated days, senior facilities, utilities, construction and industrial park leaders from fabs, foundries, IDMs, memory makers and OSAT/ATMP sites will share what is working on active builds across Singapore, Taiwan, Korea, Japan, Southeast Asia and India. EPCs, cleanroom and MEP specialists, UPW and wastewater providers, power and gas infrastructure suppliers, and digital construction platforms will contribute practical case studies on how they are using modular construction, 3D BIM/VDC, digital twins and new execution models to de-risk capex, accelerate ramps and future-proof fabs and packaging facilities for the next decade of AI, data center, automotive and industrial demand.